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Test methods for the characterization of flow properties of hot melt adhesives by capillary rheometer. Properties of pressure sensitive films including visco-elastic and stress relaxation properties that provide information on time-dependent and long term behavior, Failure characteristics such as lap shear and butt joint data that can be used to model cohesive elements in computer simulations. Cure characteristics of reactive adhesives such as epoxy, silicones using dynamical mechanical methods and DSC.
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